Types of Camera Module Circuit Boards

I. Rigid Printed Circuit Board (PCB)

Characteristics:

High Mechanical Strength: Provides stable support for electronic components in the camera module, resistant to deformation. For instance, in industrial cameras or security cameras, the working environment may be harsh, necessitating high mechanical to ensure the camera's proper functioning.

Good Processability: Easily allows for the creation of complex circuit patterns through drilling and etching, meeting the design needs of camera modules.

Stable Electrical Performance: Offers good insulation and conductive properties, ensuring stable signal transmission. For high-resolution camera modules, stable electrical performance is crucial maintaining clear and stable image quality.

Application Scenarios: Widely used in various camera modules, especially in situations where high mechanical strength and electrical performance are required

II. Flexible Printed Circuit Board (FPC)

Characteristics:

Good Flexibility: Can bend and fold, adapting to various complex spatial structures. For example, mobile phone camera modules, where internal space is limited, FPC can bend according to the design requirements of the phone, connecting the camera to the motherboard and saving.

Lightweight and Thin: Typically has a thickness of tens to hundreds of microns, making it lighter and thinner than PCB, which helps reduce the volume and of the camera module.

High Reliability: Uses multi-layer structure design, providing good anti-interference and signal transmission performance. Additionally, FPC can be covered a protective film to enhance its wear and corrosion resistance.

Application Scenarios: Often used in camera modules with high spatial requirements and need for flexible connections, such as phone cameras and laptop cameras.

III. Rigid-Flex PCB

Characteristics:

Combines the Advantages of PCB and FPC: Possesses the mechanical and electrical performance of rigid PCB, as well as the flexibility of FPC. For example, in high-end camera modules, rigid-flex PCB can meet the performance of the camera while adapting to complex design requirements.

Enables Three-Dimensional Assembly: By arranging circuits on different layers, it allows for three-dimensional assembly of camera, improving space utilization.

High Design Flexibility: Can be customized according to specific needs, meeting the special requirements of different camera modules.

Application Scenarios: Suitable camera modules with high performance and spatial requirements, such as high-end smartphone cameras and digital camera lenses.